Dinamička čvrstoća lemljenih spojeva elektroničkih sklopova uslijed cikličkog toplinskog i vibracijskog opterećenja

Ključar, Luka (2012) Dinamička čvrstoća lemljenih spojeva elektroničkih sklopova uslijed cikličkog toplinskog i vibracijskog opterećenja. = Master's thesis (Bologna) , Sveučilište u Zagrebu, Fakultet strojarstva i brodogradnje, UNSPECIFIED. Mentor: Božić, Željko.

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Abstract (Croatian)

U ovom radu je izvršena analiza jednostavnog PCB-a (Printed Circuit Board) pod toplinskim i vibracijskim opterećenjem kako bi se odredio životni vijek lemljenih spojeva. Analiza uključuje toplinsku i dinamičku analizu metodom konačnih elemenata (MKE). Kako bi se bolje razumio problem zamora lemljenih spojeva, dan je uvod u teorijske osnove vibracija, što uključuje vibracije ploča, uvod u vremenski neovsino neelastično ponašanje materijala, te je dan pregled LCF-a (Low Cycle Fatigue) i HCF-a (High Cycle Fatigue).

Abstract

In this thesis an analysis of a simple PCB (Printed Circuit Board) under combined thermal and vibration loading has been conducted in order to estimate the fatigue life of the solder joints. This includes a FEM (Finite Element Method) dynamic and thermal analysis of solder joints. The goal was to develop a feasible FEM based methodology for combined thermal and vibration loading. In order to increase the understanding the problem of the fatigue of solder joints, a number of theoretical fundamentals are given, which include an introduction to vibration fundamentals, which include basics of vibration of plates, time independent inelastic material behavior is described and an overview of LCF (Low Cycle Fatigue) and HCF (High Cycle Fatigue) is also given.

Item Type:	Thesis (Master's thesis (Bologna))
Uncontrolled Keywords:	solder; fatigue; combined loading
Date Deposited:	22 Sep 2014 18:00
Last Modified:	16 Oct 2015 12:58
URI:	http://repozitorij.fsb.hr/id/eprint/1626

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